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Intel Thermal Solution Combo
DHBXSTS100C
New product
Intel combo boxed thermal solution for 2-socket servers/workstations. Maximum CPU TDP: 130W. Combination heat sink with removable fan. For LGA1366 Nehalem Xeons.
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Intel combo boxed thermal solution for 2-socket servers/workstations. Maximum CPU TDP: 130W. Combination heat sink with removable fan. For LGA1366 Nehalem Xeons.